Applications

The system is perfectly used for cleaning and surface activation prior to semiconductor packaging process such as die bonding, wire bonding, underfill, molding, etc., capable to effectively remove the surface contaminants of organics and oxides from the packaging materials, excellently enhancing the bonding strength and adhesion performance, thus significantly improving the process yield. With automatic substrates or lead frames loading and unloading assembly, the system is featured with fast cleaning cycle and high cleaning uniformity, particularly suitable for highly demanding production where very high performance of cleaning results is mandatory.

Features

• Enhanced surface treatment
• Consistent high-uniformity cleaning
• High throughput (450 strips/h for 5 lanes)
• Automatic operation with loading/unloading for max 5 lanes
• Automatic quick conversion of lane width for product changeover
• Unique air cooling design in chamber bottom
• Smart operation and detailed display
• IPC & PLC based control system with touch screen