Applications

The system is perfectly used for cleaning and surface activation prior to semiconductor packaging process such as die bonding, wire bonding, underfill, molding, etc., capable to effectively remove the surface contaminants from the packaging materials, excellently enhancing the bonding strength and adhesion performance, thus significantly improving the process yield. The system possesses a large-capacity chamber and advancedly-designed electrodes, combing high-uniformity cleaning and production efficiency.

Features

• Max 16 magazines loading capacity
• Advanced electrode design & excellent uniformity
• Outstanding cleaning result & reliable performance
• Slim structure with pump built-in
• Superior vacuum performance with booster pump
• Intuitive graphical user interface