Dry Lift Off Machine
(AMR-2200G)
Feature
Drastic saving the cost of usual liquid (usual wet system) and the cost of treatment of liquid waste can be done by adopting mechanical peeling system. Moreover, by combination with our Dry Resist Tape Laminating Machine, it corresponds with Plating process by dry resist, Lift Off process, drastic saving the cost of liquid and waste of resist by spin coating in wet peeling process. Takatori also can decrease wafer breakage, wafer crack by using unique technique which has been developed with Takatori machines for thin wafers.
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sales2024-08-12 15:21:342024-08-23 11:15:17Dry Lift Off Machine (AMR-2200G)
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sales2024-08-12 12:02:332024-08-23 11:14:29Dry Lift Off Machine (AMR-4000A)