Dry Lift Off Machine (AMR-4000A)

Dry Lift Off Machine

(AMR-4000A)

Feature

Remove the metal by adhesive tape saves at solvent WET process in downstream
process .(50% less lifting time compared to WET process)
The metal on the wafer surface is removed by tape, effectively removed and
recycled *the unnecessary metal* (recovery rate of 80~90%).
The tape is laminated on the wafer by roller , and the metal is removed from the
wafer according to setting speed and angle. (by recipe)