Wafer Laser Grooving
(LWS3000)
- Ps Laser grooving to minimize thermal HAZ and heat accumulation in grooving line.
- Ultra stable grooving stage @1,000mm/s with 0.5μm straightness.
- Built-in coating and cleaning module to prevent contamination.
- Multi beams grooving to maximize WPH.
- Minimize energy loss through optical beam shaping.
- Automatic exchange for narrow and wide beam processing.
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sales2024-08-13 15:16:252024-08-23 11:18:22Wafer Laser Marking (LWM3000)
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sales2024-08-13 15:08:082024-08-23 11:17:43Wafer Laser Grooving (LWS3000)