研磨用表面保护胶带
◎Universal : BGF–130N, BGF–150N, BGF–180N, BGF-200N。
适用于研磨完成厚度为200~600um之产品，其优点为平坦度佳、厚度公差小、翘曲小。
◎For Thin Wafer: BGF-105HE, BGF-165HE, BGF-95T-30, FUB-95T-30。
适用于超薄晶圆的研磨，可有效抑制晶圆翘曲之研磨用保护胶带 ，具优良精准的胶带厚度， 能确保研磨制程后晶圆的厚度。
◎For Bumped Wafer: FUB-100E-200S, FUB-150E-200S, FUB-95T-100S-30, BGF-95T-100S-30。
针对如凸块、锡球及INK等产品，提供保护作用，让产品在制程中不易产生气泡而导致渗酸、渗水。
BG Tape (Non-UV Type)
| Item | Backing | Color | Total Thickness (um) | Base Thickness (um) | Adhesive Thickness (um) | Adhesion (N/25mm) | Recommended workpieces |
| BGF-XXXN-AR | PO | Blue | 130/150/180/200 | 100/150 | 30/50 | 0.35/0.85/1.5/2.0 | Standard types ( for wafer Grinding process about 600um~150um of thickness) |
| BGF-105HE-XX | PO | Blue | 130/135/155 | 105 | 25/30/50 | 0.35/0.85/1.5/2.0 | Thin-wafer types ( for wafer Grinding process about 600um~50um of thickness) |
| BGF-165HE-XX | PO | Blue | 185/195/205 | 165 | 20/30/40 | 0.35/0.85/1.5/2.0 | Thin-wafer types ( for wafer Grinding process about 600um~50um of thickness) |
| BGF-95T-30 | PET | Blue | 125 | 95 | 30 | 0.35/0.85/1.5/2.0 | Anti Acid types ( for after wafer Grinding process and with Acid process ) |
| FND-100AE-30 | PO | Blue | 130 | 100 | 30 | 0.35/0.85/1.5/2.0 | Anti Acid types ( for after wafer Grinding process and with Acid process ) |
| FGE-110 | CPP | Blue | 110 | 100 | 10 | 0.35/0.85/1.5/2.0 | Anti Acid types ( for after wafer Grinding process and with Acid process ) |
BG Tape (UV Type)
| Item | Backing | Color | Base Thickness (um) | Adhesive Thickness (um) | Total Thickness (um) | Adhesion (N/25mm) | Adhesion After UV (N/25mm) | Recommended workpieces | Dosage of UV (mj/cm2) |
| FUB-100E-XX | PO | Transparent | 100 | 20/30 | 120/130 | 7.50 | 0.20 | UV types (for after wafer Grinding process, easy to detaping) | 500 |
| FUB-150E-XX | PO | Transparent | 150 | 20/30 | 170/180 | 7.50 | 0.20 | UV types (for after wafer Grinding process, easy to detaping) | 500 |
| FUB-150AE-XX | PO | White | 150 | 20/30 | 170/180 | 7.50 | 0.20 | UV types (for after wafer Grinding process, easy to detaping) | 500 |
| FUB-95T-30 | PET | Transparent | 95 | 30 | 125 | 5.00 | 0.20 | UV types (for after wafer Grinding process, easy to detaping) | 500 |
| FUB-100T-30 | PET | Transparent | 100 | 30 | 130 | 7.50 | 0.20 | UV types (for after wafer Grinding process, easy to detaping) | 500 |
Bumping BG Tape
| Item | Backing | Color | Total Thickness (um) | Base Thickness (um) | Soft Layer Thickness (um) | Adhesive Thickness (um) | Adhesion (N/25mm) | Adhesion After UV (N/25mm) | Recommended workpieces | Dosage of UV (mj/cm2) |
| BGF-105HE-XX | PO-B | Blue | 155/165 | 105 | 50/60 | 1.5/2.0 | NA | For middle-bump wafer | NA | |
| BGF-100AE-XX | PO-B | Blue | 150/170 | 100 | 50/70 | 1.5/2.0 | NA | For middle-bump wafer | NA | |
| BGF-100E-100S-XX | PO-B | Blue | 220/230/250 | 100 | 100 | 20/30/50 | 1.5/2.0 | NA | For High-bump wafer | NA |
| FUB-95T-100S-30 | PET | White | 225 | 95 | 100 | 30 | 12.00 | 0.20 | For High-bump wafer | 1000 |
| FUB-95T-100S-30 | PET | White | 225 | 95 | 100 | 30 | 17.00 | 0.20 | For High-bump wafer | 1000 |