SiC wafers have excellent material properties and play an important and key role in the electric vehicle power component industry under the global trend of green energy and carbon
reduction.

KINIK has designed high cutting force and high self-sharpening vitrified grinding wheels according to the material characteristics and customer needs, which have been successfully applied to the grinding process of SiC substrate and reclaim wafers, enabling customers to greatly improve the grinding quality and processing efficiency, and further reduce manufacturing costs.