晶圆雷射打标设备(LWM3000)

晶圆雷射打标设备

(LWM3000)

All in one marking – Silicon, lamination film and tape through marking.
High WPH – Two marking head @1,000mm/s/head speed.
High accuracy : <±50μm @12" wafer.
Fully automatic marking line width change.
Key function – fully automatic marking inspection, laser power. compensation, scanner calibration and center offset compensation between wafer and ring frame.
Support big warpage wafer marking using special press ring.