KINIK grinding wheels are used in the grinding process for IF-series (in-feed type grinders), which use Two types – one for coarse grinding, another for fine grinding.

KINIK combination of the grinding wheels can greatly improve the finish quality. We recommend a combination that satisfies workpiece size, required thickness and finish roughness.

Applications: Thinning process of Silicon wafers, MEMS/ LED, IC/Package, Diode

Specification：
Wheel types :Coarse / Fine wheel / Super- Fine wheel
Wafer types :Bare Si wafers / Patterned Si wafers / Etched wafers / Glass wafers / Compound wafers
Roughness :Below 0.06μm