De-mounter
(TADM-6800FR-SN/TADM-6800FR-SN)
Feature
TADM-6800FR-SN is used in the grinding process of semiconductors to take off the protective film on the front side of the wafer after grinding. The equipment adopts the semi-automatic operation mode of picking and placing the wafer, automatically detape the film, and automatically receive the tape; it also can be used for wafers with frames, and the protective tape on the front of the wafer can be removed; the dicing tape can be attached to the back of the wafer with frame, and the dicing tape on the frame can be removed.