Wafer Cleaner
(CL Series)
Feature
- Built-in vacuum generator and automatic drainage device.
-
Using two-fluid nozzle enhance the cleansing effect.
- Option for pure nitrogen gas cleaning drying process.
- System control board can set up Chinese/ English version.
- Cleaning 6~12 inch wafer, also have customize chuck service.
- Provide any cleaning application mode, also can offer three nozzle washed way.
Specification
| Item | CL6801 | CL1201 |
| Work piece(mm) | 6″~8″ | 6″~12″ |
| Frame Size(mm) | 2-6 2-6-1 2-8-1 | 2-6-1 2-8-1 2-10-1 2-12-1 |
| High pressure water pressure (Mpa) | 2~12 | 2~12 |
| Vacuum chuck (power) revolutions (mm/rpm) | 0~3000 rpm/Max. | 0~3000 rpm/Max. |
| Power supply | AC110 / 220 V | AC110 / 220 V |
| Air Pressure volume (kgf/cm²+G) | 6 | 6 |
| Maximum air flow (L/min(ANR) | Max. 100 | Max. 150 |
| Water Pressure volume (kgf/cm²L) | 2~3 | 2~3 |
| Maximum water flow (L/min) | Max. 10 | Max. 15 |
| Nitrogen pressure (kgf/cm²+G) | 4~5 | 4~5 |
| Maximum Nitrogen flow (L/min(ANR)) | Max. 100 | Max. 150 |
| The minimum amount of suction (m³/min) | Min. 5.0 | Min. 5.0 |
| Dimensions (mm) | 850 x 450 x 1200 | 850 x 550 x 1200 |
| Weight (kg) | 90 | 120 |
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