Wafer Cleaner

(CL Series)

Feature

  1. Built-in vacuum generator and automatic drainage device.
  2. Using two-fluid nozzle enhance the cleansing effect.

  3. Option for pure nitrogen gas cleaning drying process.
  4. System control board can set up Chinese/ English version.
  5. Cleaning 6~12 inch wafer, also have customize chuck service.
  6.  Provide any cleaning application mode, also can offer three nozzle washed way.

Specification

Machine modelsCL-6801CL-1201
Iron frame dimensions8 inches12 inches
Cleaning methodsWater + air mix into two fluidsWater + air mix into two fluids
Spindle variable frequency motor1/2 horsepower1 horsepower
Speed range0~3000 rpm (recommended startup speed 200~3000 rpm). 0~3000 rpm (recommended startup speed 200~3000 rpm).
Recipe parameter settings1010
Step count88
Air input pressure0.3~0.5 MPa (Φ8mm flexible tube). 0.3~0.5 MPa (Φ8mm flexible tube).
Maximum air consumption100 liters/min100 liters/min
N2 is the input pressure0.3~0.5 MPa (Φ8mm flexible tube). 0.3~0.5 MPa (Φ8mm flexible tube).
N2 maximum consumption80 liters/minute80 liters/minute
Water input pressure0.2~0.4 MPa(Φ8mm 柔性軟管)。 0.2~0.4 MPa(Φ8mm 柔性軟管)。
Maximum water usage1 liter/minute1 liter/minute
Volume of exhaust gas in the exhaust pipe5 cubic meters per minute (cmm).5 cubic meters per minute (cmm).
Exhaust duct dimensionsOuter diameter: Φ 76mmOuter diameter: Φ 76mm
Drainage pipe dimensionsOuter diameter Φ34mmOuter diameter Φ34mm
Mechanical dimensions500 (West) * 850 (length) * 1200 (H) mmAbout 170 kilograms

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