Full Auto Ring Cutting Equipment

(AR6100RR)

Feature

Wafer ring cutting equipment is a completely new system. It is based on the existing fully automatic model AR9000, adding a manipulator for debonding and taking rings, a UV irradiation station, a station for taking rings, a waste ring conveying manipulator, and a waste ring collection station. It can achieve high-efficiency production and stable ring removal with ring cutting of more than 16 pieces/hour. Using this equipment, the wafer under the TAIKO process can be cut, cleaned, debonded, and ring removed, and the outer ring of the wafer under the TAIKO process can be automatically removed.

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