Fully-Automatic Wafer De-Lamination Machine

(ATRM-22400TKUV)

Feature

  1. Compared to previous model, this machine has about half footprint.
  2. Integrated model with UV irradiation machine.
  3. Backside non-contact removing is available for TAIKO.
  4. 180 degree removal mechanism allows stable removing.

Similar Products

© 2016 Copyright - 東洋技術股份有限公司
- made by bouncin