Semi-Automatic Wafer Mounter

(SAM-12)

Feature

  1. Contactless mounting table which holds wafer at 3mm edge part.
    (Vacuum for wafer holding is not necessary.)
  2. The adoption of a vacuum chamber system allows for reduced stress
    on the attachment rollers and the elimination of air bubbles, thereby
    preventing damage to the wafers and packages.
  3. Tension control for all types of tapes is possible, so the optimal coating
    can be achieved to match post-processing requirements.
  4. Automatic tape supply, tape coiling, wastage tape coiling, tape cutting.
    (UV tape applicable)
  5. Applicable for thin wafer.

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