Semi-Automatic Wafer Mounter
(SAM-12)
Feature
- Contactless mounting table which holds wafer at 3mm edge part.
(Vacuum for wafer holding is not necessary.) - The adoption of a vacuum chamber system allows for reduced stress
on the attachment rollers and the elimination of air bubbles, thereby
preventing damage to the wafers and packages. - Tension control for all types of tapes is possible, so the optimal coating
can be achieved to match post-processing requirements. - Automatic tape supply, tape coiling, wastage tape coiling, tape cutting.
(UV tape applicable) - Applicable for thin wafer.