300MM Automatic Wafer De-Lamination System

(ATRM-4000A)

Feature

  1. Protective tape remover for 12-inch (300 mm) wafers.
  2. Partition between the wafer cassette and maintenance section minimizes the space for a clean room by putting the maintenance section outside the clean room.
  3. Holding a wafer precisely with a unique wafer table and removing the protective tape without giving stress.
  4. Interactive mode allows easier operation.
  5. FOUP cassette, AGV and OHT protocol, built-in UV radiation. (Option)

Specification

Item
ATRM-4000A
Throughput

70 wafer/h (Depend on data setting)
Wafer Size
8″, 12″
Tape Width8″: 50~75mm; 12″: 75~100mm
Utilities – Power

AC100V Single phase 50/60Hz 2.5 KVA
Utilities – Air

Pressure 0.4Mpa 100N1/min(ANR)
Utilities – Vacuum sourse~74Kpa
Dimensions
D1,625 X W1,350 X H1,800 mm
Weight
600kg

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