300MM Automatic Wafer De-Lamination System
(ATRM-4000A)
Feature
- Protective tape remover for 12-inch (300 mm) wafers.
- Partition between the wafer cassette and maintenance section minimizes the space for a clean room by putting the maintenance section outside the clean room.
- Holding a wafer precisely with a unique wafer table and removing the protective tape without giving stress.
- Interactive mode allows easier operation.
- FOUP cassette, AGV and OHT protocol, built-in UV radiation. (Option)
Specification
| Item | ATRM-4000A |
| Throughput | 70 wafer/h (Depend on data setting) |
| Wafer Size | 8″, 12″ |
| Tape Width | 8″: 50~75mm; 12″: 75~100mm |
| Utilities – Power | AC100V Single phase 50/60Hz 2.5 KVA |
| Utilities – Air | Pressure 0.4Mpa 100N1/min(ANR) |
| Utilities – Vacuum sourse | ~74Kpa |
| Dimensions | D1,625 X W1,350 X H1,800 mm |
| Weight | 600kg |
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sales2016-11-02 16:04:212019-04-24 16:46:18300MM Automatic Wafer De-Lamination System (ATRM-4000A)
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sales2016-11-02 15:59:232019-04-24 16:48:08200MM Fully-Auto BG Tape Removal System (ATRM-2300)