200MM Fully-Auto BG Tape Removal System
(ATRM-2300)
Feature
- Thin wafers down to 150 microns.
- Available on warped wafer .
- Every other cassette slot applicable
- Integrated UV unit(optional).
- Can be made to accommodate special wafers and special tapes.
- Applicable to use for TAIKO wafers(optional).
Specification
| Item | ATRM-2300 |
| Throughput | 45 wafers/h (Depend on data setting) |
| Wafer Size | 4″, 5″, 6″, 8″(3 sizes can be selected) |
| Film Width | 4.5.6″: 38mm; 8″: 50.75mm |
| Utilities – Power | AC100V Single phase 50/60Hz 2.0 KVA |
| Utilities – Air | Pressure 0.5~0.8Mpa 90N1/min(ANR) |
| Utilities – Vacuum sourse | ~74Kpa |
| Dimensions | D980 X W1,340 X H1,665 mm |
| Weight | 400kg |
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sales2024-08-12 11:41:302024-08-23 11:12:40Fully-Automatic Wafer De-Lamination Machine (ATRM-2400TKUV)
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sales2016-11-02 16:04:212024-08-23 10:47:15300MM Automatic Wafer De-Lamination System (ATRM-4000A)
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sales2016-11-02 15:59:232024-08-20 16:01:06200MM Fully-Auto BG Tape Removal System (ATRM-2300)