200MM 晶圓撕片機
(ATRM-2300)
特性
- THIN WAFER可到 150 microns。
- 可用WARPED WAFER。
- 可適用任何提籃。
- 連接UV機(選配)。
- 可適用特殊晶圓和膠帶。
- 可適用TAIKO wafers(選配)。
規格表
| Item | ATRM-2300 |
| Throughput | 45 wafers/h (Depend on data setting) |
| Wafer Size | 4″, 5″, 6″, 8″(3 sizes can be selected) |
| Film Width | 4.5.6″: 38mm; 8″: 50.75mm |
| Utilities – Power | AC100V Single phase 50/60Hz 2.0 KVA |
| Utilities – Air | Pressure 0.5~0.8Mpa 90N1/min(ANR) |
| Utilities – Vacuum sourse | ~74Kpa |
| Dimensions | D980 X W1,340 X H1,665 mm |
| Weight | 400kg |
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sales2016-11-02 16:04:212019-04-24 16:24:47300MM 晶圓撕片機 (ATRM-4000A)
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sales2016-11-02 15:59:232019-04-24 16:25:05200MM 晶圓撕片機 (ATRM-2300)