200MM Full-Automatic Dry-resist Film Laminator
(ATM-1100K)
Feature
- Lamination pressure on and the temperature of whole wafer surface are uniformed.
- DFR lamination roller temperature is precisely controlled.
- DFR lamination tension is uniformed (Non-tension lamination and tenting lamination are available.)
- Corresponding to protective tape lamination for back-grind process
- Environment friendly design (long life consumable parts, minimizing film consumption etc.)
- Improved workability
Specification
| Item | ATM-1100K |
| Wafer Size | 4″, 5″, 6″, 8″ |
| Film Width | 130~230mm width |
| Utilities – Power | AC200V Single phase 50/60Hz 4.0 KVA |
| Utilities – Air | 0.4-0.5Mpa 90NL/min |
| Utilities – Vacuum sourse | ~74Kpa |
| Dimensions | D1,340 X W1,030 X H1,750 mm (signal tower light not including) |
| Weight | 700kg |
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sales2017-02-07 14:57:512024-08-20 15:59:30200MM Full-Automatic Dry-resist Film Laminator (ATM-1100K)
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