200MM Fully-Auto Vacuum Laminator
(TEAM-100ARF)
Feature
- Dry-resist film saves resist solution drastically in the conventional wet resist process.
- Cutting film smaller allows the exposed area on a wafer edge part in accordance with the plate electrode.
- Laminating film in a vacuum chamber prevents bubbles on the film as well as damages to the wafer.
- Film is laminated in the manner of non-tension avoiding any stress.
Specification
| Item | TEAM-100ARF |
| Throughput | Depending on film type and using conditions. |
| Wafer Size | 5″, 6″, 8″ |
| Film Width | 5″: 150~160mm width; 6″: 180~200mm width; 8″: 225~230mm width |
| Utilities – Power | AC100V Single phase 50/60Hz 2.0 KVA |
| Utilities – Air | Pressure 0.5Mpa 100N1/min |
| Utilities – Vacuum sourse | ~74 Kpa |
| Dimensions | D1,190 X W1,490 X H1,660 mm |
| Weight | 600kg |
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