200MM 晶圆撕片机
(ATRM-2300)
特性
- THIN WAFER可到 150 microns。
- 可用WARPED WAFER。
- 可适用任何提篮。
- 连接UV机(选配)。
- 可适用特殊晶圆和胶带。
- 可适用TAIKO wafers(选配)。
规格表
| Item | ATRM-2300 |
| Throughput | 45 wafers/h (Depend on data setting) |
| Wafer Size | 4″, 5″, 6″, 8″(3 sizes can be selected) |
| Film Width | 4.5.6″: 38mm; 8″: 50.75mm |
| Utilities – Power | AC100V Single phase 50/60Hz 2.0 KVA |
| Utilities – Air | Pressure 0.5~0.8Mpa 90N1/min(ANR) |
| Utilities – Vacuum sourse | ~74Kpa |
| Dimensions | D980 X W1,340 X H1,665 mm |
| Weight | 400kg |
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sales2024-06-13 17:11:092024-08-26 17:34:43200mm全自动晶圆撕片机(ATRM-22400TKUV)
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sales2016-11-02 16:04:212024-08-23 10:46:53300MM 晶圆撕片机 (ATRM-4000A)
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sales2016-11-02 15:59:232024-08-20 15:34:26200MM 晶圆撕片机 (ATRM-2300)