200MM 全自動真空晶圓貼片機
(TEAM-100ARF)
特性
- 可使用DRF膠帶在wet resist process。
- 可用小於晶圓表面的膠帶與面積板電極的晶片暴露邊緣部分。
- 在真空室貼合膠帶可減少氣泡和破片的發生。
- 在無壓力下貼合膠帶。
規格表
| Item | TEAM-100ARF |
| Throughput | Depending on film type and using conditions. |
| Wafer Size | 5″, 6″, 8″ |
| Film Width | 5″: 150~160mm width; 6″: 180~200mm width; 8″: 225~230mm width |
| Utilities – Power | AC100V Single phase 50/60Hz 2.0 KVA |
| Utilities – Air | Pressure 0.5Mpa 100N1/min |
| Utilities – Vacuum sourse | ~74 Kpa |
| Dimensions | D1,190 X W1,490 X H1,660 mm |
| Weight | 600kg |
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sales2016-11-02 14:43:382019-04-24 16:30:58200MM 全自動真空晶圓貼片機 (TEAM-100ARF)