300MM Fully-Auto Vacuum Film Laminator
(TEAM-300)
Feature
- Correspondence to various kind of film.
- Dry-resist film saves resist solution drastically in the conventional wet resist process.
- Cutting film smaller allows the exposed area on a wafer edge part in accordance with the plate electrode.
- Laminating film in a vacuum chamber prevents bubbles on the film as well as damages to the wafer.
- Film is laminated in the manner of non-tension avoiding any stress.
- Clean capability for front-end process. (option)
Specification
| Item | TEAM-300 |
| Throughput | Depending on film type and using conditions. |
| Wafer Size | 12″, 8″(option) |
| Film Width | 12″ 330mm width |
| Utilities – Power | AC200V Three phase 50/60Hz |
| Utilities – Air | Pressure 0.5-0.8Mpa 400N1/min |
| Dimensions | D2,250 X W2,100 X H2,300 mm |
| Weight | 1,200kg |
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