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Semi-Auto Measurement System

(AT-S300 Series)

Advantage

  1. Auto-Load recipe by Barcode.
  2. Auto Re-measurement function.
  3. Adjustable for Spectrum wavelength.
  4. Re-update statistic data function.
  5. Re-execute single or multi-location measurement task.
  6. Easer-tuning for measurement recipe.
  7. Anti-Interfere for High-Bump wafer thickness measurement.
  8. Multi-Spectrometer configuration for option.
  9. FAST 3D wafer map & 2D curve data drawing function.
  10. Smart search function for Target layer signal.
More Details

System SPEC

Item
SPECAT-S300TAT-S300RAT-S300TR
Wavelength1470~1530nm (Adjustable)VV
Sensor working distance5~8mmVV
Wafer type 2″~12″(unframed and framed)VVV
Thickness
Measuring accuracy		less than +/-0.5um (Silicon)VV
Thickness
Measuring range		7um~800um
Base on Silicon		VV
Film Measuring range10um~120um (DAF)VV
Thickness
Measuring repeatability		less than +/-0.5umVV
Roughness
Measuring range		Ra 1nm~100nmVV
Roughness Measuring repeatability & AccuracyRa less than 20nm(+/-0.5nm);
Ra more than 20nm(5%)		VV
OptionSECS/GEM EXTENSIONVVV
OptionTHIN-FILM Measurement moduleVVV
OptionESD IONIZERVVV

◎The Accuracy depend on the used  wavelengths.

Compare with German Brand

Model nameAT-S300系列德系301系列
Measurement Accuracy+/-0.5um+/-0.5um
Measurement Repeatability+/-0.5um
+/-0.5um
Without Z-axis focusing damage risk
YesX
Incoming wafer Warpage limitation for Thickness measurementless than 5mmless than 1.2mm
Wafer warpage measure limitationMax. 5000um
Max. 1200um
High-warpage wafer THK measurementYesX
High-warp wafer Warpage measurementYesX
Auto search main measure target
YesX
Auto search good signal area (Re-try)
YesX
Adjustble wavelength
YesX
Re-Update measured data function
YesX
Fast – 3D wafer map
YesX
Thick-DAF layer thickness application
YesX
Thin-DAF layer thickness applicationYesX

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