半自动晶圆量测机
(AT-S300系列)
特性
- 条形码加载量测程序功能。
- 自动搜寻量测主要目标。
- 自动搜寻良好讯号区域功能。
- 简易调整量测程序。
- 可重复指定量测功能。
- 可调式波长光谱配置。
- 自动汇整数据与重新上传。
- 可多波长光谱仪配置一机多用。
- 快速 3D形貌 & 2D线段绘图分析。
设备量测规格
项目 | 规格 | AT-S300T | AT-S300R | AT-S300TR |
光谱仪波长范围 | 1470~1530nm(可微调式) | V | V | |
探头工作距离 | 5~8mm | V | V | |
晶圆对应形式 | 2″~12″(unframed and framed) | V | V | V |
厚度量测精度 (Silicon) | less than +/-0.5um | V | V | |
厚度量测范围 (Silicon) | 7um~800um Base on Silicon | V | V | |
薄膜量测范围 (DAF) | 10um~120um | V | V | |
厚度量测重复性 | less than +/-0.5um | V | V | |
粗糙度量测范围 | Ra 1nm~100nm | V | V | |
粗糙度量测精度与重复性 | Ra less than 20nm(+/-0.5nm); Ra more than 20nm(5%) | V | V | |
选配 | SECS/GEM EXTENSION | V | V | V |
选配 | THIN-FILM Measurement module | V | V | V |
选配 | ESD IONIZER | V | V | V |
◎ 量测精度均与厚度标准片验证。
与德系厂牌比较表
Model name | AT-S300系列 | 德系301系列 |
Measurement Accuracy | +/-0.5um | +/-0.5um |
Measurement Repeatability | +/-0.5um | +/-0.5um |
Without Z-axis focusing damage risk | Yes | X |
Incoming wafer Warpage limitation for Thickness measurement | less than 5mm | less than 1.2mm |
Wafer warpage measure limitation | Max. 5000um | Max. 1200um |
High-warpage wafer THK measurement | Yes | X |
High-warp wafer Warpage measurement | Yes | X |
Auto search main measure target | Yes | X |
Auto search good signal area (Re-try) | Yes | X |
Adjustble wavelength | Yes | X |
Re-Update measured data function | Yes | X |
Fast – 3D wafer map | Yes | X |
Thick-DAF layer thickness application | Yes | X |
Thin-DAF layer thickness application | Yes | X |