300MM Automatic Wafer Mounter with Detape function
(ATM-12000DR)
Feature
- Capable of handing 12”150um thickness wafer and aligning precisely.
- Vacuum chamber application eliminates air bubbles and less damage wafers.
- Removing without any stress to wafer by unique method.
Specification
| Item | ATM-12000DR |
| Throughput | 40 wafers/h (Depend on data setting) |
| Wafer Size | 8″, 12″ |
| Frame Size | 8″, 12″ |
| Frame Width | 8″: 300mm; 12″: 400mm (Removal tape width: 50mm) |
| Utilities – Power | AC200V Three phase 50/60Hz 5.0 KVA |
| Utilities – Air | Pressure 0.5Mpa 200N1/min |
| Utilities – Vacuum sourse | Using venturi valus |
| Dimensions | D2,800 X W1,800 X H1,800 mm |
| Weight | 2,000kg |
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