200MM Full-Automatic Wafer Mounter
(ATM-8200)
Feature
- Full Automatic Wafer Mounter with Minimum foot print in the world.
- No damage due to lamination roller on ultra thin and no air bubbles because of adopting vacuum chamber.
- Tension control for all types of tapes is possible, so the optimal coating can be achieved to match post-processing requirements.
- Applicable for thin wafer.
Specification
Item | ATM-8200 |
Throughput | 95 wafers/h (Depend on data setting) |
Wafer Size | 4″, 5″, 6″, 8″ |
Frame Size | 6″, 8″ |
Film Width | 6″: 230mm; 8″: 300mm |
Accuracy in Positioning Wafer | ±0.5mm in X-Y direction and ±0.5mm in θangle (against frame) |
Utilities – Power | AC100V Single phase 50/60Hz 2.0 KVA |
Utilities – Air | Pressure 0.5Mpa 300N1/min |
Utilities – Vacuum sourse | Using venturi valus |
Dimensions | D1,150 X W1,330 X H1,800 mm |
Weight | 700kg |