200MM Automatic Wafer Mounter (ATM-8100 Series)

200MM Automatic Wafer Mounter

(ATM-8100 Series)

Feature

Mounting minimum 150-micron thick and max 5 mm-warped wafers.
No damage due to lamination roller on ultra thin and no air bubbles because of adopting vacuum chamber.
To process thin warped wafers, correcting the warpage inside vacuum chamber.
Memorizing tape tension to meet wide range of tapes.
To process 50 micron thick wafers, equipping the pattern recognition alignment and loader for coin stack jar, and integration with B/G machine, Etching machine, DM-800A and-200.(Option)

Item	ATM-8100 Series
Wafer Size	5″, 6″, 8″
Frame Size	6″, 8″
Tape Width	pre-cut tape 6″: 220mm; 8″: 290mm non pre-cut tape 6″: 230mm; 8″: 300mm
Utilities – Power	AC200V Single phase 50/60Hz 6.0 KVA
Utilities – Air	Pressure 0.4-0.5Mpa 300N1/min
Option	UV unit for B/G tape, ID reader barcode labeler