300mm 全自動真空晶圓貼片機
(TEAM-300)
特性
- 適用各種膠帶。
- 可使用DRF膠帶在wet resist process。
- 可用小於晶圓表面的膠帶與面積板電極的晶片暴露邊緣部分。
- 在真空室貼合膠帶可減少氣泡和破片的發生。
- 在無壓力下貼合膠帶。
- 可選配清洗功能。
規格表
| Item | TEAM-300 |
| Throughput | Depending on film type and using conditions. |
| Wafer Size | 12″, 8″(option) |
| Film Width | 12″ 330mm width |
| Utilities – Power | AC200V Three phase 50/60Hz |
| Utilities – Air | Pressure 0.5-0.8Mpa 400N1/min |
| Dimensions | D2,250 X W2,100 X H2,300 mm |
| Weight | 1,200kg |
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